Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12111114 | Heat transfer element, method for forming the same and semiconductor structure comprising the same | Hung-Hsien Huang, Shin-Luh TARNG, Chien-Neng Liao, Jui-Cheng Yu, Po-Cheng Huang | 2024-10-08 |
| 11901252 | Semiconductor device package and method of manufacturing the same | Ming-Han Wang | 2024-02-13 |