Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12111114 | Heat transfer element, method for forming the same and semiconductor structure comprising the same | Hung-Hsien Huang, Shin-Luh TARNG, Ian HU, Jui-Cheng Yu, Po-Cheng Huang | 2024-10-08 |