Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901252 | Semiconductor device package and method of manufacturing the same | Ian HU | 2024-02-13 |
| 11869828 | Semiconductor package through hole with lever arms and insulating layers with different coefficient of thermal expansion | Yi-Chi Chen | 2024-01-09 |