Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087652 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Jen-Chieh Kao | 2024-09-10 |
| 11869828 | Semiconductor package through hole with lever arms and insulating layers with different coefficient of thermal expansion | Ming-Han Wang | 2024-01-09 |