Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119312 | Device package | Cheng-Nan Lin, Wei-Tung CHANG, Huei-Shyong Cho | 2024-10-15 |
| 12087652 | Semiconductor package device and method of manufacturing the same | Yi-Chi Chen, Chang-Lin Yeh | 2024-09-10 |
| 11862544 | Electronic assembly | Chang-Lin Yeh | 2024-01-02 |