Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176276 | Semiconductor device package and method for manufacturing the same | — | 2024-12-24 |
| 12087652 | Semiconductor package device and method of manufacturing the same | Yi-Chi Chen, Jen-Chieh Kao | 2024-09-10 |
| 12089349 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Yung-I Yeh, Sheng-Yu Chen | 2024-09-10 |
| 11997888 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Sheng-Yu Chen, Yung-I Yeh | 2024-05-28 |
| 11948852 | Semiconductor device package | — | 2024-04-02 |
| 11942385 | Semiconductor package structure | Sheng-Yu Chen, Ming-Hung Chen | 2024-03-26 |
| 11862544 | Electronic assembly | Jen-Chieh Kao | 2024-01-02 |