Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12089349 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Yung-I Yeh, Chang-Lin Yeh | 2024-09-10 |
| 11997888 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Chang-Lin Yeh, Yung-I Yeh | 2024-05-28 |
| 11942385 | Semiconductor package structure | Chang-Lin Yeh, Ming-Hung Chen | 2024-03-26 |