Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11718767 | Chemical mechanical planarization composition for polishing oxide materials and method of use thereof | Ming-Shih Tsai, Chia-Chien Lee, Rung-Je Yang, Anu Mallikarjunan, Chris Keh-Yeuan Li +2 more | 2023-08-08 |
| 11692110 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2023-07-04 |
| 11667839 | Low oxide trench dishing chemical mechanical polishing | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2023-06-06 |
| 11608451 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with tunable silicon oxide and silicon nitride removal rates | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2023-03-21 |
| 11549034 | Oxide chemical mechanical planarization (CMP) polishing compositions | Xiaobo Shi, Krishna P. Murella, Hongjun Zhou, Mark Leonard O'Neill | 2023-01-10 |