Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11821847 | Wafer backside defect detection method and wafer backside defect detection apparatus | Cheng-Hsien Chen, Chia-Feng Hsiao, Chung-Hsuan Wu, Chen-Hui Huang, En-Wei Tsui +2 more | 2023-11-21 |
| 11644427 | Automatic detection method and automatic detection system for detecting crack on wafer edges | Chia-Feng Hsiao, Chung-Hsuan Wu, Shuo-Yu Chen, Yi-Hui Tseng, Chen-Hui Huang +2 more | 2023-05-09 |