Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11821847 | Wafer backside defect detection method and wafer backside defect detection apparatus | Cheng-Hsien Chen, Chia-Feng Hsiao, Chung-Hsuan Wu, Chen-Hui Huang, Nai-Ying Lo +2 more | 2023-11-21 |