Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11821847 | Wafer backside defect detection method and wafer backside defect detection apparatus | Chia-Feng Hsiao, Chung-Hsuan Wu, Chen-Hui Huang, Nai-Ying Lo, En-Wei Tsui +2 more | 2023-11-21 |
| 11562923 | Semiconductor arrangement including a first electrical insulator layer and a second electrical insulator layer and method of making | Wei-Liang Chen, Yu-Lung Yeh, Chuang Chihchous, Yen-Hsiu Chen | 2023-01-24 |