Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11644427 | Automatic detection method and automatic detection system for detecting crack on wafer edges | Chia-Feng Hsiao, Chung-Hsuan Wu, Nai-Ying Lo, Yi-Hui Tseng, Chen-Hui Huang +2 more | 2023-05-09 |