Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830791 | Leads for leadframe and semiconductor package | You Chye How | 2023-11-28 |
| 11791170 | Universal semiconductor package molds | Chong Han Lim, Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim | 2023-10-17 |
| 11742263 | Flippable leadframe for packaged electronic system having vertically stacked chip and components | Lee Han Meng@ Eugene Lee, Wei Fen Sueann Lim | 2023-08-29 |
| 11626350 | Cutting a leadframe assembly with a plurality of punching tools | Chong Han Lim, Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim, Siew Kee Lee | 2023-04-11 |
| 11569152 | Electronic device with lead pitch gap | Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim, Siew Kee Lee | 2023-01-31 |
| 11569154 | Interdigitated outward and inward bent leads for packaged electronic device | Mohammad Waseem Hussain | 2023-01-31 |