Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791170 | Universal semiconductor package molds | Anis Fauzi Bin Abdul Aziz, Chong Han Lim, Lee Han Meng@Eugene Lee | 2023-10-17 |
| 11742263 | Flippable leadframe for packaged electronic system having vertically stacked chip and components | Lee Han Meng@ Eugene Lee, Anis Fauzi Bin Abdul Aziz | 2023-08-29 |
| 11626350 | Cutting a leadframe assembly with a plurality of punching tools | Chong Han Lim, Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz, Siew Kee Lee | 2023-04-11 |
| 11569152 | Electronic device with lead pitch gap | Anis Fauzi Bin Abdul Aziz, Lee Han Meng@Eugene Lee, Siew Kee Lee | 2023-01-31 |