Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791170 | Universal semiconductor package molds | Anis Fauzi Bin Abdul Aziz, Lee Han Meng@Eugene Lee, Wei Fen Sueann Lim | 2023-10-17 |
| 11715678 | Roughened conductive components | Yee Gin TEA | 2023-08-01 |
| 11626350 | Cutting a leadframe assembly with a plurality of punching tools | Lee Han Meng@Eugene Lee, Anis Fauzi Bin Abdul Aziz, Wei Fen Sueann Lim, Siew Kee Lee | 2023-04-11 |