Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855001 | Leadless leadframe and semiconductor device package therefrom | David Chin, Dorothy Lyou Mantle | 2023-12-26 |
| 11569154 | Interdigitated outward and inward bent leads for packaged electronic device | Anis Fauzi Bin Abdul Aziz | 2023-01-31 |