Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854819 | Germanium hump reduction | Shih-Hao Fu, Hung-Ju Chou, Che-Lun Chang, Jiun-Ming Kuo, Yuan-Ching Peng +2 more | 2023-12-26 |
| 11848209 | Patterning semiconductor devices and structures resulting therefrom | Chun-Yu Kao, Chia-Cheng Chao | 2023-12-19 |
| 11810824 | Semiconductor device and manufacturing method thereof | Chung-Ting Ko, Chi On Chui | 2023-11-07 |
| 11557518 | Gapfill structure and manufacturing methods thereof | Chi On Chui, Fang-Yi Liao, Chunyao Wang, Yung-Cheng Lu | 2023-01-17 |