Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855220 | Method and structure for air gap inner spacer in gate-all-around devices | Shih-Chiang Chen, Wei-Yang Lee, Chia-Pin Lin | 2023-12-26 |
| 11854819 | Germanium hump reduction | Shih-Hao Fu, Hung-Ju Chou, Che-Lun Chang, Jiun-Ming Kuo, Sung-En Lin +2 more | 2023-12-26 |
| 11848241 | Semiconductor structure and related methods | Hung-Jiu Chou, Jiun-Ming Kuo | 2023-12-19 |
| 11799002 | Semiconductor devices and methods of forming the same | Yen-Po Lin, Wei-Yang Lee, Chia-Pin Lin, Jiun-Ming Kuo | 2023-10-24 |
| 11764277 | Semiconductor structure and method for manufacturing the same | Yu-Fan Peng, Yu-Bey Wu, Yu-Shan Lu, Ying-Yan Chen, Yi-Cheng Li +1 more | 2023-09-19 |
| 11735665 | Dielectric fin structure | Yu-Shan Lu, Chung-I Yang, Kuo-Yi Chao, Wen-Hsing Hsieh, Jiun-Ming Kuo +1 more | 2023-08-22 |
| 11631745 | Semiconductor device structure with uneven gate profile | Chi-Sheng Lai, Yu-Fan Peng, Li Chen, Yu-Shan Lu, Yu-Bey Wu +6 more | 2023-04-18 |