Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854819 | Germanium hump reduction | Shih-Hao Fu, Hung-Ju Chou, Che-Lun Chang, Jiun-Ming Kuo, Yuan-Ching Peng +2 more | 2023-12-26 |
| 11830727 | Forming low-stress silicon nitride layer through hydrogen treatment | Wei-Che Hsieh, Ching-Yu Huang, Hsin-Hao Yeh, Tze-Liang Lee | 2023-11-28 |
| 11764221 | Semiconductor device and method of manufacture | Wan-Yi Kao, Hung-Cheng Lin, Yung-Cheng Lu, Chi On Chui | 2023-09-19 |
| 11688645 | Structure and formation method of semiconductor device with fin structures | Kun-Yu Lee, Chi On Chui | 2023-06-27 |
| 11652158 | Field-effect transistor device with gate spacer structure | Wei-Che Hsieh | 2023-05-16 |
| 11557518 | Gapfill structure and manufacturing methods thereof | Sung-En Lin, Chi On Chui, Fang-Yi Liao, Yung-Cheng Lu | 2023-01-17 |