Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848209 | Patterning semiconductor devices and structures resulting therefrom | Sung-En Lin, Chia-Cheng Chao | 2023-12-19 |
| 11655555 | Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same | Yun-Hsing Sung, Shih-Shen Lee, Hung-Wei Hsu | 2023-05-23 |