Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11655555 | Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2023-05-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11655555 | Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same | Shih-Shen Lee, Hung-Wei Hsu, Chun-Yu Kao | 2023-05-23 |