Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688759 | Metal-insulator-metal capacitive structure and methods of fabricating thereof | Hsiang-Ku Shen, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2023-06-27 |
| 11587863 | Semiconductor structure and method of forming semiconductor package | Chih-Kuang Kao, Ta-Chih Peng, Huei-Wen Yang | 2023-02-21 |