DC

Dian-Hau Chen

TSMC: 19 patents #106 of 4,064Top 3%
Overall (2023): #2,260 of 537,848Top 1%
19
Patents 2023

Issued Patents 2023

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
11855132 Multilayer capacitor electrode Hsiang-Ku Shen 2023-12-26
11855022 Shielding structures Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Hong-Seng Shue +1 more 2023-12-26
11842959 Metal-Insulator-Metal structure Yuan-Yang Hsiao, Hsiang-Ku Shen 2023-12-12
11791371 Resistor structure Chih-Fan Huang, Hsiang-Ku Shen, Yen-Ming Chen 2023-10-17
11778918 Magnetic memory cell with low-resistive electrode via and method of forming same Hsiang-Ku Shen, Liang-Wei Wang 2023-10-03
11744084 Semiconductor devices and method of forming the same Hsiang-Ku Shen, Liang-Wei Wang, Yen-Ming Chen 2023-08-29
11728295 Semiconductor device and method of manufacturing thereof Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Ying-Yao Lai 2023-08-15
11728375 Metal-insulator-metal (MIM) capacitor structure Chih-Fan Huang, Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen +1 more 2023-08-15
11728262 Metal plate corner structure on metal insulator metal Yuan-Yang Hsiao, Hsiang-Ku Shen, Hsiao Ching-Wen, Yao-Chun Chuang 2023-08-15
11716910 MRAM structure for balanced loading Chih-Fan Huang, Hsiang-Ku Shen, Liang-Wei Wang, Chen-Chiu Huang, Yen-Ming Chen 2023-08-01
11715756 Device structure and methods of forming the same Tsung-Chieh Hsiao, Hsiang-Ku Shen, Yuan-Yang Hsiao, Ying-Yao Lai 2023-08-01
11705384 Through vias of semiconductor structure and method of forming thereof Yuan-Yang Hsiao, Yen-Ming Chen 2023-07-18
11688759 Metal-insulator-metal capacitive structure and methods of fabricating thereof Hsiang-Ku Shen, Ming-Hong Kao, Hui-Chi Chen, Yen-Ming Chen 2023-06-27
11676895 Semiconductor device comprising air gaps having different configurations Yu-Bey Wu, Jye-Yen Cheng, Sheng-Hsuan Wei, Li-Yu Lee, Tai-Yang Wu 2023-06-13
11670573 Low-stress passivation layer Hsiang-Ku Shen, Chun-Li Lin 2023-06-06
11670608 Prevention of metal pad corrosion due to exposure to halogen Chih-Fan Huang, Hui-Chi Chen, Chih-Sheng Li, Chih-Hung Lu, Yen-Ming Chen 2023-06-06
11659771 Structure and method for integrating MRAM and logic devices Hsiang-Ku Shen 2023-05-23
11659774 Structure and method for MRAM devices having spacer element Hsiang-Ku Shen 2023-05-23
11581276 Redistribution layers and methods of fabricating the same in semiconductor devices Hsiang-Ku Shen 2023-02-14