Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587863 | Semiconductor structure and method of forming semiconductor package | Chih-Kuang Kao, Ta-Chih Peng, Ming-Hong Kao | 2023-02-21 |
HY
Huei-Wen Yang
Overall (2023): #418,834 of 537,848Top 80%
1
Patents 2023