Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587863 | Semiconductor structure and method of forming semiconductor package | Ta-Chih Peng, Ming-Hong Kao, Huei-Wen Yang | 2023-02-21 |
CK
Chih-Kuang Kao
Overall (2023): #489,423 of 537,848Top 95%
1
Patents 2023