Issued Patents 2023
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11729997 | 3D stackable memory and methods of manufacture | Chih-Yu Chang, Han-Jong Chia, Sai-Hooi Yeong, Yu-Ming Lin | 2023-08-15 |
| 11723209 | Three-dimensional memory device and manufacturing method thereof | Chun-Fu Cheng, Feng-Cheng Yang, Sheng-Chen Wang, Yu-Chien Chiu, Han-Jong Chia | 2023-08-08 |
| 11716857 | Semiconductor memory device and manufacturing method thereof | Yu-Chien Chiu, Chun-Fu Cheng, Han-Jong Chia, Chung-Wei Wu, Zhiqiang Wu | 2023-08-01 |
| 11716856 | Three-dimensional memory device and method | Bo-Feng Young, Chih-Yu Chang, Sai-Hooi Yeong, Yu-Ming Lin | 2023-08-01 |
| 11703642 | Protective ring structure to increase waveguide performance | Yung-Chang Chang | 2023-07-18 |
| 11706917 | Structure and method for preventing silicide contamination during the manufacture of micro-processors with embedded flash memory | Wei-Cheng Wu | 2023-07-18 |
| 11706914 | Method of forming an array boundary structure to reduce dishing | Te-Hsin Chiu, Wei-Cheng Wu, Li-Feng Teng, Chien-Hung Chang | 2023-07-18 |
| 11696449 | Semiconductor devices and methods of manufacturing thereof | Chia-En Huang | 2023-07-04 |
| 11688784 | Transistor layout to reduce kink effect | Te-Hsin Chiu, Wei-Cheng Wu | 2023-06-27 |
| 11683936 | Semiconductor memory structure and method of manufacturing the same | Chia-En Huang | 2023-06-20 |
| 11678492 | Memory device, semiconductor device and manufacturing method of the memory device | Feng-Cheng Yang, Sheng-Chen Wang, Han-Jong Chia | 2023-06-13 |
| 11657863 | Memory array test structure and method of forming the same | Sai-Hooi Yeong, Chi On Chui | 2023-05-23 |
| 11653500 | Memory array contact structures | Chih-Yu Chang, Sai-Hooi Yeong, Bo-Feng Young, Yu-Ming Lin | 2023-05-16 |
| 11647636 | Memory devices | Mauricio Manfrini, Han-Jong Chia | 2023-05-09 |
| 11647637 | Semiconductor memory devices and methods of manufacturing thereof | Chia-En Huang | 2023-05-09 |
| 11647634 | Three-dimensional memory device and method | Feng-Cheng Yang, Han-Jong Chia, Sheng-Chen Wang, Chung-Te Lin | 2023-05-09 |
| 11631682 | Metal isolation testing in the context of memory cells | Te-Hsin Chiu, Wei-Cheng Wu | 2023-04-18 |
| 11587823 | Three-dimensional memory device and method | Han-Jong Chia, Sheng-Chen Wang, Feng-Cheng Yang, Chung-Te Lin | 2023-02-21 |
| 11581337 | Three-dimensional memory device and manufacturing method thereof | Sheng-Chen Wang, Sai-Hooi Yeong, Yu-Ming Lin, Han-Jong Chia | 2023-02-14 |
| 11581368 | Memory device, integrated circuit device and method | Sai-Hooi Yeong, Han-Jong Chia, Chenchen Jacob Wang, Yu-Ming Lin | 2023-02-14 |
| 11574929 | 3D ferroelectric memory | Sheng-Chen Wang, Feng-Cheng Yang, Sai-Hooi Yeong, Yu-Ming Lin, Han-Jong Chia | 2023-02-07 |
| 11569264 | 3D RAM SL/BL contact modulation | Sheng-Chen Wang, Feng-Cheng Yang, Han-Jong Chia | 2023-01-31 |
| 11569267 | Method for forming integrated circuit | Te-An Chen | 2023-01-31 |
| 11569251 | High voltage polysilicon gate in high-K metal gate device | Te-Hsin Chiu | 2023-01-31 |
| 11562998 | Capacitor and method for forming the same | Meng-Sheng Chang | 2023-01-24 |