Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830875 | Method to embed planar FETS with FINFETS | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Li-Jung Liu | 2023-11-28 |
| 11825651 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2023-11-21 |
| 11758721 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2023-09-12 |
| 11742348 | Semiconductor device and method for forming the same | Wei-Cheng Wu, Harry-Hak-Lay Chuang, Li-Jung Liu | 2023-08-29 |
| 11706914 | Method of forming an array boundary structure to reduce dishing | Meng-Han Lin, Te-Hsin Chiu, Wei-Cheng Wu, Chien-Hung Chang | 2023-07-18 |
| 11600618 | Integrated circuit structure and manufacturing method thereof | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Fang-Lan Chu, Ya-Chen Kao | 2023-03-07 |
| 11594620 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2023-02-28 |