Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600618 | Integrated circuit structure and manufacturing method thereof | Harry-Hak-Lay Chuang, Li-Feng Teng, Wei-Cheng Wu, Ya-Chen Kao | 2023-03-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600618 | Integrated circuit structure and manufacturing method thereof | Harry-Hak-Lay Chuang, Li-Feng Teng, Wei-Cheng Wu, Ya-Chen Kao | 2023-03-07 |