Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742295 | Interface of integrated circuit die and method for arranging interface thereof | Ting Wang, Ting-Chin Cho, Igor Elkanovich, Amnon Parnass, Chia-Hsiang Chang +13 more | 2023-08-29 |
| 11658091 | Methods of manufacturing semiconductor packaging device and heat dissipation structure | Chi-Ming Yang, YEN-CHAO LIN | 2023-05-23 |
| 11570886 | Circuit board device | Yu-Ju Chang, Ding-Kang Shen, Yun-Jia Li | 2023-01-31 |