Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855091 | Boundary design for high-voltage integration on HKMG technology | Yi-Huan Chen, Chien-Chih Chou, Alexander Kalnitsky, Kong-Beng Thei, Ming Chyi Liu +1 more | 2023-12-26 |
| 11784460 | Bump bonding structure to mitigate space contamination for III-V dies and CMOS dies | Ming Chyi Liu | 2023-10-10 |