Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11586797 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2023-02-21 |
HS
Hsiu-Chuan Shu
Overall (2023): #420,478 of 537,848Top 80%
1
Patents 2023