HC

Hsi-Kuei Cheng

TSMC: 1 patents #2,163 of 4,064Top 55%
📍 Zhubeikou, TW: #108 of 199 inventorsTop 55%
Overall (2023): #420,764 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11756849 Package and package-on-package structure having elliptical columns and ellipsoid joint terminals Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more 2023-09-12