Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810804 | Method of forming dice and structure of die | Hsiu-Mei Yu, Wei-Chan Chang, Chun-Yi Wu | 2023-11-07 |
| 11694909 | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method | Hsin-Hsien Lu | 2023-07-04 |
| 11588036 | High-efficiency packaged chip structure and electronic device including the same | Hsiu-Mei Yu, Cheng-Yi Hsieh, Wei-Chan Chang, Chun-Yi Wu | 2023-02-21 |