Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11588036 | High-efficiency packaged chip structure and electronic device including the same | Hsiu-Mei Yu, Wei-Chan Chang, Chang-Sheng Lin, Chun-Yi Wu | 2023-02-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11588036 | High-efficiency packaged chip structure and electronic device including the same | Hsiu-Mei Yu, Wei-Chan Chang, Chang-Sheng Lin, Chun-Yi Wu | 2023-02-21 |