Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810804 | Method of forming dice and structure of die | Hsiu-Mei Yu, Chang-Sheng Lin, Chun-Yi Wu | 2023-11-07 |
| 11588036 | High-efficiency packaged chip structure and electronic device including the same | Hsiu-Mei Yu, Cheng-Yi Hsieh, Chang-Sheng Lin, Chun-Yi Wu | 2023-02-21 |