HJ

Hyung Jun Jeon

Samsung: 1 patents #7,162 of 17,037Top 45%
📍 Seoul, KR: #3,051 of 7,884 inventorsTop 40%
Overall (2023): #418,142 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11728200 Wafer bonding apparatuses Hoe Chul Kim, Seok Ho Kim, Tae-Yeong Kim, Hoon-Joo Na 2023-08-15