Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728200 | Wafer bonding apparatuses | Seok Ho Kim, Tae-Yeong Kim, Hoon-Joo Na, Hyung Jun Jeon | 2023-08-15 |
HK
Hoe Chul Kim
Overall (2023): #421,980 of 537,848Top 80%
1
Patents 2023