Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728200 | Wafer bonding apparatuses | Hoe Chul Kim, Seok Ho Kim, Tae-Yeong Kim, Hyung Jun Jeon | 2023-08-15 |
| 11588039 | Semiconductor device | Chan Hyeong LEE, Sung-in Suh, Min-Woo Song, Byoung Hoon Lee, Hu-Yong Lee +1 more | 2023-02-21 |