Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728200 | Wafer bonding apparatuses | Hoe Chul Kim, Seok Ho Kim, Hoon-Joo Na, Hyung Jun Jeon | 2023-08-15 |
| 11640912 | Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substrates | Jun-Hyung Kim, Sung-Hyup Kim | 2023-05-02 |