Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854892 | Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them | Junho Yoon, Byungmoon Bae, Junggeun Shin, Hyunsu Sim | 2023-12-26 |
| 11828952 | Light source and extreme ultraviolet light source system using the same | Dohyung Kim, Seongchul Hong, Kyungsik Kang, Kyungbin Park, Motoshi Sakai +1 more | 2023-11-28 |
| 11823927 | Wafer inspection apparatus and system including the same | Kyunghun Han, Ingi Kim, Sangwoo Bae, Minhwan Seo, Myeongock Ko +3 more | 2023-11-21 |
| 11778719 | Laser beam delivery apparatus for extreme ultra violet light source | Dohyung Kim, Seongchul Hong, Kyungsik Kang, Insung Kim, Motoshi Sakai +1 more | 2023-10-03 |