Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854892 | Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them | Junho Yoon, Jungchul Lee, Junggeun Shin, Hyunsu Sim | 2023-12-26 |
| 11676914 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Heejae Nam, Junggeun Shin, Hyunsu Sim, Junho Yoon +1 more | 2023-06-13 |