Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11815551 | Die-to-die connectivity monitoring using a clocked receiver | Eyal Fayneh, Evelyn Landman | 2023-11-14 |
| 11762789 | Integrated circuit I/O integrity and degradation monitoring | Eyal Fayneh, Evelyn Landman, Shai Cohen, Inbar WEINTROB | 2023-09-19 |
| 11740281 | Integrated circuit degradation estimation and time-of-failure prediction using workload and margin sensing | Eyal Fayneh, Edi Shmueli, Alexander BURLAK, Evelyn Landman, Inbar WEINTROB +2 more | 2023-08-29 |
| 11619551 | Thermal sensor for integrated circuit | Eyal Fayneh, Shaked Rahamim, Evelyn Landman | 2023-04-04 |