Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11841395 | Integrated circuit margin measurement and failure prediction device | Evelyn Landman, Shai Cohen, Yahel DAVID, Inbar WEINTROB | 2023-12-12 |
| 11815551 | Die-to-die connectivity monitoring using a clocked receiver | Guy REDLER, Evelyn Landman | 2023-11-14 |
| 11762013 | Integrated circuit profiling and anomaly detection | Evelyn Landman, Yahel DAVID, Shai Cohen, Yair Talker | 2023-09-19 |
| 11762789 | Integrated circuit I/O integrity and degradation monitoring | Evelyn Landman, Shai Cohen, Guy REDLER, Inbar WEINTROB | 2023-09-19 |
| 11740281 | Integrated circuit degradation estimation and time-of-failure prediction using workload and margin sensing | Edi Shmueli, Alexander BURLAK, Evelyn Landman, Inbar WEINTROB, Yahel DAVID +2 more | 2023-08-29 |
| 11619551 | Thermal sensor for integrated circuit | Guy REDLER, Shaked Rahamim, Evelyn Landman | 2023-04-04 |