Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11757426 | Manufacturing method for surface acoustic wave filter package structure | Che-Wei Hsu | 2023-09-12 |
| 11749612 | Semiconductor package device | Chun-Hsien Yu, Hsien-Ming Tsai | 2023-09-05 |
| 11658104 | Intermediate substrate and fabrication method thereof | Chu-Chin Hu, Pao-Hung Chou | 2023-05-23 |
| 11552014 | Semiconductor package structure and method of making the same | Che-Wei Hsu, Chao-Tsung Tseng | 2023-01-10 |