Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791281 | Package substrate and method for manufacturing the same | You-Lung Yen, Pao-Hung Chou | 2023-10-17 |
| 11749612 | Semiconductor package device | Shih-Ping Hsu, Hsien-Ming Tsai | 2023-09-05 |
| 11646331 | Package substrate | Hsien-Ming Tsai | 2023-05-09 |