Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791281 | Package substrate and method for manufacturing the same | You-Lung Yen, Chun-Hsien Yu | 2023-10-17 |
| 11658104 | Intermediate substrate and fabrication method thereof | Shih-Ping Hsu, Chu-Chin Hu | 2023-05-23 |