Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749612 | Semiconductor package device | Chun-Hsien Yu, Shih-Ping Hsu | 2023-09-05 |
| 11646331 | Package substrate | Chun-Hsien Yu | 2023-05-09 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749612 | Semiconductor package device | Chun-Hsien Yu, Shih-Ping Hsu | 2023-09-05 |
| 11646331 | Package substrate | Chun-Hsien Yu | 2023-05-09 |