Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830842 | Hybrid device assemblies and method of fabrication | Li Li, Jeffrey K. Jones | 2023-11-28 |
| 11749639 | Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods | Jaynal A. Molla | 2023-09-05 |
| 11621228 | Substrate with thermal vias and sinter-bonded thermal dissipation structure | Lu Li, Freek Egbert van Straten | 2023-04-04 |
| 11621231 | Methods of fabricating leadless power amplifier packages including topside terminations | Yun Wei, Fernando A. Santos, Scott D. Marshall | 2023-04-04 |
| 11621673 | Power amplifier packages and systems incorporating design-flexible package platforms | Jean-Christophe Nanan, David J. Dougherty, Scott D. Marshall, Xavier Hue | 2023-04-04 |