Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621231 | Methods of fabricating leadless power amplifier packages including topside terminations | Yun Wei, Lakshminarayan Viswanathan, Scott D. Marshall | 2023-04-04 |
| 11581241 | Circuit modules with front-side interposer terminals and through-module thermal dissipation structures | Boon Yew Low, Li Li, Fui Yee Lim, Lan Chu Tan | 2023-02-14 |