Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787097 | Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes | Sheila F. Chopin, Nishant Lakhera | 2023-10-17 |
| 11581241 | Circuit modules with front-side interposer terminals and through-module thermal dissipation structures | Fernando A. Santos, Li Li, Fui Yee Lim, Lan Chu Tan | 2023-02-14 |